Abrasive slurries are critical process materials in semiconductor manufacturing, precision optics, advanced ceramics and high-performance surface finishing. Their efficiency depends on particle size distribution, particle concentration, morphology, refractive index and the absence of oversized contaminants or aggregates. Accurate characterization of abrasive particles enables manufacturers to optimize polishing performance, improve process repeatability and reduce surface defects. Classizer™ ONE, based on the patented SPES technology, provides advanced single-particle characterization, supporting research, process development and quality assurance through rapid multiparametric particle analysis.
Silica Particles
Commercial silica suspensions are widely used as reference materials and polishing media for precision finishing processes. In this example, a mixture of monodisperse 0.3 μm and 2.0 μm silica particles is analysed using Classizer™ ONE. The EOS CLOUDS representation clearly separates the two particle populations, allowing independent measurement of particle size distribution, numerical concentration and optical properties. This multiparametric approach improves quality control by rapidly identifying different particle fractions, confirming batch consistency and detecting possible contamination or aggregation events that could compromise polishing efficiency.
CeO2 slurry
Cerium oxide (CeO₂) slurries are extensively employed in Chemical Mechanical Polishing (CMP) for silicon wafers, optical components and advanced electronic devices. Reliable slurry characterization is essential because particle size distribution and optical properties directly influence material removal rate and surface quality. Classizer™ ONE analyses commercial CeO₂ slurries dispersed in water, accurately determining the effective refractive index together with particle size distribution and concentration. These measurements support process optimization, slurry consistency and routine quality control throughout semiconductor manufacturing.
Diamond Paste
Diamond pastes are premium abrasive formulations used for precision polishing, lapping and finishing of extremely hard materials. Their performance depends on maintaining a controlled particle population with consistent optical and physical properties. Using SPES technology, Classizer™ ONE determines particle size distribution together with an effective refractive index close to the expected value of approximately 2.4, confirming formulation quality. The ability to detect abnormal particles, aggregates or contaminants provides valuable support for manufacturing control and the production of high-performance abrasive materials.
