Slurries are aqueous dispersions of compact or mesopouros particles required by the most advanced technology for the silicon-based products, but found applications also in a number of industrial processes such as production of compact disks, hard disks and optical surface polishing. The characteristics of the abrasive material, their structure and size distribution typically play an important role in determining their removal properties. CLASSIZER™ ONE is the perfect tool for charactering both the size distribution, compactners of the mesopouros structure and the presence of solid contaminant or subvisible/submicron-scale aggregates.

Find out more

The case of ceria slurries for the chemical mechanical polishing of silicon wafer

(in figure) CLASSIZER™ characterization of ceria slurry typically employed in chemical mechanical polishing (CMP) of silicon wafer. The dashed line is the expected field distribution for spheres with the refractive index of ceria. The red continuous line describes the median of the distribution obtained by selecting bins along the vertical direction.